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 PROFET(R) BTS 432 I2
Smart Highside Power Switch
Features
* * * * * * * * * * * *
Product Summary Clamp 80 58 4.5 ... 42 -32 38 42 33 11 V V V V m A A A
Load dump and reverse battery protection1) VLoad dump Clamp of negative voltage at output Vbb-VOUT Avalanche Short-circuit protection Vbb (operation) Current limitation Vbb (reverse) Thermal shutdown RON Diagnostic feedback Open load detection in OFF-state IL(SCp) CMOS compatible input IL(SCr) Electrostatic discharge (ESD) protection IL(ISO) Loss of ground and loss of Vbb protection2) Overvoltage protection Undervoltage and overvoltage shutdown with auto-restart and hysteresis
5 1
5
Application
* C compatible power switch with diagnostic feedback for 12 V and 24 V DC grounded loads * All types of resistive, inductive and capacitve loads * Replaces electromechanical relays and discrete circuits
SMD
Standard
General Description
N channel vertical power FET with charge pump, ground referenced CMOS compatible input and diagnostic feedback, integrated in Smart SIPMOS(R) chip on chip technology. Fully protected by embedded protection functions.
R bb + Vbb
3
Voltage source V Logic Voltage sensor
Overvoltage protection
Current limit
Gate protection
OUT
Charge pump Level shifter Rectifier
Limit for unclamped ind. loads Open load
2
IN
Temperature sensor
5
Load
ESD
Logic
detection
4
ST
Short circuit detection
GND
(R) PROFET
Load GND
1
Signal GND
1) 2)
No external components required, reverse load current limited by connected load. Additional external diode required for charged inductive loads
Infineon Technologies AG
Page 1 of 15
1999-02-19
BTS 432 I2
Pin 1 2 3 4 5 Symbol GND IN Vbb ST OUT (Load, L) I + S O Function Logic ground Input, activates the power switch in case of logical high signal Positive power supply voltage, the tab is shorted to this pin Diagnostic feedback, low on failure Output to the load
Maximum Ratings at Tj = 25 C unless otherwise specified Parameter Supply voltage (overvoltage protection see page 3) Load dump protection VLoadDump = UA + Vs, UA = 13.5 V RI= 2 , RL= 1.1 , td= 200 ms, IN= low or high Load current (Short-circuit current, see page 4) Operating temperature range Storage temperature range Power dissipation (DC) Inductive load switch-off energy dissipation, single pulse Tj=150 C: Electrostatic discharge capability (ESD) (Human Body Model) Input voltage (DC) Current through input pin (DC) Current through status pin (DC)
see internal circuit diagrams page 6...
Symbol Vbb Vs 3) IL Tj Tstg Ptot EAS VESD VIN IIN IST
Values 63 66.5 self-limited -40 ...+150 -55 ...+150 125 1.7 2.0 -0.5 ... +6 5.0 5.0 1 75 tbd
Unit V V A C W J kV V mA
Thermal resistance
chip - case: RthJC junction - ambient (free air): RthJA SMD version, device on pcb4):
K/W
3) 4)
VS is setup without DUT connected to the generator per ISO 7637-1 and DIN 40839 Device on 50mm*50mm*1.5mm epoxy PCB FR4 with 6cm2 (one layer, 70m thick) copper area for Vbb connection. PCB is vertical without blown air.
Infineon Technologies AG
Page 2
1999-02-19
BTS 432 I2 Electrical Characteristics
Parameter and Conditions
at Tj = 25 C, Vbb = 12 V unless otherwise specified
Symbol
Values min typ max
Unit
Load Switching Capabilities and Characteristics On-state resistance (pin 3 to 5) IL = 2 A Tj=25 C: RON Tj=150 C: Nominal load current (pin 3 to 5) ISO Proposal: VON = 0.5 V, TC = 85 C Output current (pin 5) while GND disconnected or GND pulled up, V IN = 0, see diagram page 7, Tj =-40...+150C Turn-on time to 90% VOUT: Turn-off time to 10% VOUT: RL = 12 , Tj =-40...+150C Slew rate on 10 to 30% VOUT, RL = 12 , Tj =-40...+150C Slew rate off 70 to 40% VOUT, RL = 12 , Tj =-40...+150C Operating Parameters Operating voltage 5) Tj =-40...+150C: Undervoltage shutdown Tj =-40...+150C: Undervoltage restart Tj =-40...+150C: Undervoltage restart of charge pump see diagram page 12 Tj =-40...+150C: Undervoltage hysteresis Vbb(under) = Vbb(u rst) - Vbb(under) Overvoltage shutdown Tj =-40...+150C: Overvoltage restart Tj =-40...+150C: Overvoltage hysteresis Tj =-40...+150C: Overvoltage protection6) Tj =-40C: Ibb=40 mA Tj =25...+150C: Standby current (pin 3) VIN =0, IST=0, Tj=-40...+25C: Tj=150C: Operating current (Pin 1)7), VIN =5 V
5) 6) 7)
-9 --
30 55 11 --
38 70 -1
m A mA s
IL(ISO) IL(GNDhigh)
ton toff dV /dton -dV/dtoff
50 10 0.4 1
160 ----
300 80 2.5 5
V/s V/s
Vbb(on) Vbb(under) Vbb(u rst) Vbb(ucp) Vbb(under) Vbb(over) Vbb(o rst) Vbb(over) Vbb(AZ) Ibb(off)
4.5 2.4 ---42 42 -60 63 ---
---6.5 0.2 --0.2 -67 40 50 1.1
42 4.5 4.5 7.5 -52 ----
V V V V V V V V V A
70 110 -mA
IGND
--
At supply voltage increase up to Vbb= 6.5 V typ without charge pump, VOUT Vbb - 2 V see also VON(CL) in table of protection functions and circuit diagram page 7. Meassured without load. Add IST , if IST > 0, add IIN, if VIN>5.5 V
Infineon Technologies AG
Page 3
1999-02-19
BTS 432 I2
Protection Functions Initial peak short circuit current limit (pin 3 to 5)8), IL(SCp) ( max 400 s if V ON > V ON(SC) ) Tj =-40C: Tj =25C: Tj =+150C: Repetitive short circuit current limit IL(SCr) Tj = Tjt (see timing diagrams, page 10) Short circuit shutdown delay after input pos. slope VON > VON(SC), Tj =-40..+150C: td(SC)
min value valid only, if input "low" time exceeds 30 s
--22 20 80
-42 -33 --
72 ---400
A
A s V V C K J
Output clamp (inductive load switch off) at V OUT = V bb - V ON(CL), IL= 30 mA Short circuit shutdown detection voltage (pin 3 to 5) Thermal overload trip temperature Thermal hysteresis Inductive load switch-off energy dissipation9), Tj Start = 150 C, single pulse Vbb = 12 V: Vbb = 24 V: Reverse battery (pin 3 to 1) 10) Integrated resistor in V bb line Diagnostic Characteristics Open load detection current Open load detection voltage Tj=-40..150C:
VON(CL) VON(SC) Tjt Tjt EAS ELoad12 ELoad24 -Vbb Rbb
--150 ---
58 8.3 -10 --
----1.7 1.3 1.0 32 --
---
-120
V
IL(off) VOUT(OL)
10 2
30 3
60 4
A V
)
9)
Short circuit current limit for max. duration of 400 s, prior to shutdown (see td(SC) page 4)
While demagnetizing load inductance, dissipated energy in PROFET is EAS= VON(CL) * iL (t) dt, approx. VON(CL) 2 EAS= 1/2 * L * IL * ( ), see diagram page 8 VON(CL) - Vbb 10) Reverse load current (through intrinsic drain-source diode) is normally limited by the connected load. Reverse current IGND of 0.3 A at Vbb= -32 V through the logic heats up the device. Time allowed under these condition is dependent on the size of the heatsink. Reverse IGND can be reduced by an additional external GND-resistor (150 ). Input and Status currents have to be limited (see max. ratings page 2 and circuit page 7).
Infineon Technologies AG
Page 4
1999-02-19
BTS 432 I2
Input and Status Feedback11) Input turn-on threshold voltage Tj =-40..+150C: Input turn-off threshold voltage Tj =-40..+150C: Input threshold hysteresis Off state input current (pin 2) On state input current (pin 2) Delay time for status with open load
after Input neg. slope (see diagram page 12)
VIN(T+) VIN(T-) VIN(T) VIN = 0.4 V: IIN(off) VIN = 3.5 V: IIN(on) td(ST OL3) td(ST SC)
1.5 1.0 -1 10 40 80
--0.5 -25 -200
2.4 --30 50 300 400
V V V A A s s
Status invalid after positive input slope (short circuit) Tj=-40 ... +150C: Status output (CMOS) Tj =-40...+150C, IST= - 50 A: Tj =-40...+150C, IST = +1.6 mA: Max. status current for current source (out): valid status output, current sink (in) : Tj =-40...+150C
VST(high)12) VST(low) -IST +IST13)
4.4 ----
5.1 ----
6.5 0.4 0.25 1.6
V mA
11) If a ground resistor R GND is used, add the voltage drop across this resistor. 12) V Vbb during undervoltage shutdown St high 13) No current sink capability during undervoltage shutdown
Infineon Technologies AG
Page 5
1999-02-19
BTS 432 I2 Truth Table
Inputlevel Normal operation Open load Short circuit to GND Short circuit to Vbb Overtemperature Undervoltage Overvoltage L = "Low" Level H = "High" Level L H L H L H L H L H L H L H Output level L H
14)
Status 432 D2 H H H L H L H H (L15)) L L L16) L16) L L 432 E2/F2 H H H L H L H H (L15)) L L H H H H 432 I2 H H L H H L L H L L L16) L16) L L
H L L H H L L L L L L
Terms
Ibb 3 I IN IN 2 I ST V V bb R IN VST 4 ST GND 1 GND IGND VOUT PROFET OUT 5 Vbb IL VON
Status output
VLogic ST
GND
ESDZD
Zener diode: 6.1 V typ., max 5 mA, VLogic 5 V typ, ESD zener diodes are not designed for continuous current
Short Circuit detection Input circuit (ESD protection)
R IN I
Fault Condition: VON > 8.3 V typ.; IN high
+ V bb
ESDZDI1 ZDI2 GND
I I
Short circuit detection
V ON
OUT
ZDI1 6.1 V typ., ESD zener diodes are not designed for continuous current
Logic unit
14) Power Transistor off, high impedance 15) Low resistance short V to output may be detected by no-load-detection bb 16) No current sink capability during undervoltage shutdown
Infineon Technologies AG
Page 6
1999-02-19
BTS 432 I2
Inductive and overvoltage output clamp
+ V bb V Z V ON
GND disconnect
3 IN 2 PROFET OUT 5 Vbb
OUT GND
4 V bb V IN V ST
ST GND 1 VGND
VON clamped to 58 V typ.
Overvolt. and reverse batt. protection
+ V bb
Any kind of load. In case of Input=high is VOUT VIN - VIN(T+) . Due to VGND >0, no VST = low signal available.
GND disconnect with GND pull up
3
R IN
VZ IN
R bb
Logic
V
2
OUT
IN
Vbb PROFET OUT
R ST ST
GND
5
PROFET
4
ST GND 1
RGND
Signal GND
Rbb = 120 typ., VZ +Rbb *40 mA = 67 V typ., add RGND, RIN , RST for extended protection
V
V bb
V IN ST
V
GND
Open-load detection
OFF-state diagnostic condition: VOUT > 3 V typ.; IN low
Any kind of load. If VGND > VIN - VIN(T+) device stays off Due to VGND >0, no VST = low signal available.
Vbb disconnect with charged inductive load
3 high IN Vbb PROFET OUT
OFF
I L(OL)
2
5
4
ST GND 1
Logic unit
Open load detection
V
OUT
V
Signal GND
bb
Infineon Technologies AG
Page 7
1999-02-19
BTS 432 I2
3 high 2 IN Vbb PROFET 4 ST GND 1 OUT
Inductive Load switch-off energy dissipation
E bb E AS
5
IN V bb PROFET OUT
E
Load
=
V bb
ST GND
EL
ER
Energy dissipated in PROFET EAS = Ebb + EL - ER.
2 ELoad < EL, EL = 1/2 * L * I L
Infineon Technologies AG
Page 8
1999-02-19
BTS 432 I2 Options Overview
all versions: High-side switch, Input protection, ESD protection, load dump and reverse battery protection , protection against loss of ground Type Logic version
BTS 432D2 432E2 432F2 432I2 D E F I
Overtemperature protection Tj >150 C, latch function17)18) Tj >150 C, with auto-restart on cooling Short-circuit to GND protection
switches off when VON>8.3 V typ. 17) (when first turned on after approx. 200 s)
X X
X
X
X
X
X
X
Open load detection
in OFF-state with sensing current 30 A typ. in ON-state with sensing voltage drop across power transistor X X X X X X X X X X X X
Undervoltage shutdown with auto restart Overvoltage shutdown with auto restart Status feedback for
overtemperature short circuit to GND short to Vbb open load undervoltage overvoltage
X X -19) X X X
X X -19) X -
X X -19) X -
X X X X X X
Status output type
CMOS Open drain X X X X
Output negative voltage transient limit
(fast inductive load switch off) to Vbb - VON(CL) X X X X
Load current limit
high level (can handle loads with high inrush currents) medium level low level (better protection of application) X X X X
17) Latch except when V -V bb OUT < VON(SC) after shutdown. In most cases VOUT = 0 V after shutdown (VOUT 0 V only if forced externally). So the device remains latched unless Vbb < VON(SC) (see page 4). No latch between turn on and td(SC). 18) With latch function. Reseted by a) Input low, b) Undervoltage, c) Overvoltage 19) Low resistance short V to output may be detected by no-load-detection bb
Infineon Technologies AG
Page 9
1999-02-19
BTS 432 I2
Timing diagrams
Figure 1a: Vbb turn on: Figure 2b: Switching an inductive load
IN IN t d(bb IN) V bb ST
V
OUT
V A
OUT
ST CMOS t A
in case of too early VIN=high the device may not turn on (curve A) td(bb IN) approx. 150 s
I
L
t
Figure 3a: Turn on into short circuit, Figure 2a: Switching a lamp,
IN IN
ST ST
V VOUT
OUT
td(SC)
I I
L
L
t
td(SC) approx. 200s if Vbb - VOUT > 8.3 V typ.
t
Infineon Technologies AG
Page 10
1999-02-19
BTS 432 I2
Figure 3b: Turn on into overload, Figure 4a: Overtemperature, Reset if (IN=low) and (TjIN
IN
IL I L(SCp) I L(SCr) ST
V
OUT
ST t
T
J
t
Heating up may require several milliseconds , Vbb - VOUT < 8.3 V typ. *) ST goes high , when VIN=low and TjFigure 3c: Short circuit while on: Figure 5a: Open load: detection in ON-state, open load occurs in on-state
IN
IN ST t d(ST OL1) ST V OUT V
OUT
t d(OL ST2)
IL
**) I t
L
normal
open
normal
**) current peak approx. 20 s
t
td(ST OL1) = tbd s typ., td(ST OL2) = tbd s typ
Infineon Technologies AG
Page 11
1999-02-19
BTS 432 I2
Figure 5b: Open load: detection in OFF-state, turn on/off to open load Figure 6a: Undervoltage:
IN IN Vbb V Vbb(u cp) V bb(u rst)
ST
td(ST OL3)
bb(under)
VOUT V OUT
I
L
open
normal *) t
ST CMOS
t
in case of external capacity td(ST,OL3) may be higher due to high impedance *) IL = 30 A typ
Figure 6b: Undervoltage restart of charge pump VON [V]
Figure 5c: Open load: detection in OFF-state, open load occurs in off-state
V on
VON(CL) off
IN
ST off
V
bb(over)
V
OUT
V
V V
bb(u rst)
bb(o rst)
bb(u cp)
V I
L
bb(under)
normal load *)
open load
on V bb
Vbb [V]
normal load *) t
charge pump starts at Vbb(ucp) =6.5 V typ.
*) IL = 30 A typ
Infineon Technologies AG
Page 12
1999-02-19
BTS 432 I2
Figure 7a: Overvoltage:
IN
Vbb
V
ON(CL)
Vbb(over)
V
bb(o rst)
V
OUT
ST
t
Infineon Technologies AG
Page 13
1999-02-19
BTS 432 I2
Package and Ordering Code
All dimensions in mm
Standard TO-220AB/5
BTS 432 I2
Ordering code Q67060-S6204-A2
SMD TO-220AB/5, Opt. E3122 Ordering code
BTS 432 I2 E3122A T&R: Q67060-S6204-A3
Infineon Technologies AG
Page 14
1999-02-19
BTS 432 I2
Published by Infineon Technologies AG Balanstrae 73, D-81541 Munchen (c) Infineon Technologies AG 2002. All Rights Reserved Attention please! As far as patents or other rights of third parties are concerned, liability is only assumed for components, not for applications, processes and circuits implemented within components or assemblies. The information describes a type of component and shall not be considered as warranted characteristics. Terms of delivery and rights to change design reserved. For questions on technology, delivery and prices please contact Infineon Offices in Germany or the Infineon Companies and Representatives worldwide (see address list). Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Office. Infineon Technologies AG is an approved CECC manufacturer. Packing: Please use the recycling operators known to you. We can also help you - get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorised for such purpose! Critical components 20) of Infineon Technologies AG, may only be used in life supporting devices or systems 21) with the express written approval of Infineon Technologies AG.
20) A critical component is a component used in a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system. 21) Life support devices or systems are intended (a) to be implanted in the human body or (b) support and/or maintain and sustain and/or protect human life. If they fail, it is reasonably to assume that the health of the user or other persons may be endangered.
Infineon Technologies AG
Page 15
1999-02-19


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